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Properties of Silicon
 Material   Type   Dopant   Orientation   Diameter   Thickness   Surface   Resistivity   TTV 
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Updated: Jun 28 2017
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Silicon Wafers - Diced

Diced Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, Ox = Oxide (on that surface); Material - CZ unless noted
Note: Items sold in quantities of 25, unless noted
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Material Orient. Diam
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Ωcm
Comment
2752 2 $135.00 p-type Si:B [510] ±0.5° 6" 1,000 P/E Prolog 1-100 DICED, each wafer into 2 of 2"×3" & 2 of 2"×1" rectangles, in Individual wafer csts
D455 3 $52.00 p-type Si:B [100] ±1° 4" 460 P/E SPC 9.6-14.4 SEMI Prime, Diced into 18x18mm squares, in Individual cst
G937 24 $48.00 p-type Si:B [100] 4" 380 P/E ITME 5-10 SEMI Prime, Diced into 270 squares 5×5mm, in Individual wafer csts, sealed in Groups of 8, 8 & 8 wafers
H937 25 $60.00 p-type Si:B [100] 4" 380 P/E ITME 5-10 SEMI Prime, Individual cst, Diced into 187 rectangles 7mm×5mm, Groups of 8, 8 & 9 wafers
C650 4 $46.00 n-type Si:Sb [111-4°] ±0.5° 3" 420 P/EOx SPC 0.008-0.018 Diced into 70.11mm Squares, sealed in single wafer csts
D650 1 $20.00 n-type Si:Sb [111-4°] ±0.5° 3" 420 P/EOx SPC 0.008-0.018 Diced into 70.11mm Square, TEST grade (one corner broken), in single wafer cassette

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