Home Silicon Wafers Si Epi Wafers Si Ingots SiC Wafers SOI Wafers SoS Wafers
III-V Materials Germanium Sapphire Quartz Solar Materials Misc. Materials Order Form
Properties of Silicon
 Material   Type   Dopant   Orientation   Diameter   Thickness   Surface   Resistivity   TTV 
-
Updated: Jul 19 2024
Shopping Cart
Silicon Wafers - Diced

Diced Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Note: Items sold in quantities of 25, unless noted
Add to
Cart
Item Qty in
Stock
Price
$/wafer
Material Orient. Diam. Thck
(μm)
Surf. Source Resistivity
Ωcm
Comment
A495 21 $49.60 p-type Si:B [110] ±0.5° 4" 380 P/P ITME >1 Diced into 18 of 60×4mm rectangles (60mm edge in <001>, 4mm edge in <1,-1,0>), packed adhering to dicing tape afixed to back-up Silicon wafers in Empak cst
H937 25 $38.00 p-type Si:B [100] 4" 380 P/E ITME 5-10 SEMI Prime, Individual cst, Diced into 187 rectangles 7mm×5mm, Groups of 8, 8 & 9 wafers
C650 4 $38.00 n-type Si:Sb [111-4°] ±0.5° 4" 420 P/EOx SPC 0.008-0.018 Group of 4 wafers diced into 70.11mm Squares
D650 1 $20.00 n-type Si:Sb [111-4°] ±0.5° 4" 420 P/EOx SPC 0.008-0.018 Diced into 70.11mm Square, TEST grade (one corner broken), in single wafer cassette

EL-CAT Inc. 80 Railroad Ave., Ridgefield Park, NJ 07660 USA;  tel: 201-444-7343;  fax: 201-444-7933;  e-mail: el-cat@el-cat.com
Web Site Developed By: Mark Zakrzewski
mark@el-cat.com