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Properties of Silicon
 Material   Type   Dopant   Orientation   Diameter   Thickness   Surface   Resistivity   TTV 
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Updated: Mar 30 2023
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Silicon Wafers - Diced

Diced Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Note: Items sold in quantities of 25, unless noted
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Cart		 Item Qty in
Stock		 Price
$/wafer		 Material Orient. Diam. Thck
(μm)		 Surf. Source Resistivity
Ωcm		 Comment
A495 21 $49.60 p-type Si:B [110] ±0.5° 4" 380 P/P ITME >1 Diced into 18 of 60×4mm rectangles (60mm edge in <001>, 4mm edge in <1,-1,0>), packed adhering to dicing tape afixed to back-up Silicon wafers in Empak cst
G937 7 $48.00 p-type Si:B [100] 4" 380 P/E ITME 5-10 SEMI Prime, Diced into 270 squares 5×5mm, in Individual wafer csts, sealed in Groups of 8 wafers
H937 25 $48.00 p-type Si:B [100] 4" 380 P/E ITME 5-10 SEMI Prime, Individual cst, Diced into 187 rectangles 7mm×5mm, Groups of 8, 8 & 9 wafers
C650 4 $38.00 n-type Si:Sb [111-4°] ±0.5° 4" 420 P/EOx SPC 0.008-0.018 Diced into 70.11mm Squares, sealed in single wafer csts
D650 1 $20.00 n-type Si:Sb [111-4°] ±0.5° 4" 420 P/EOx SPC 0.008-0.018 Diced into 70.11mm Square, TEST grade (one corner broken), in single wafer cassette

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