Silicon Wafer Inventory

Properties of Silicon

Material	Type	Dopant	Orientation	Diameter	Thickness	Surface	Resistivity	TTV
							-

Updated: Oct 2 2024
Shopping Cart

Silicon Wafers - Diced

Diced Wafers

Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Note: Items sold in quantities of 25, unless noted

Item	Qty in Stock	Price $/wafer	Material	Orient.	Diam.	Thck (μm)	Surf.	Source	Resistivity Ωcm	Comment
A495	21	$49.60	p-type Si:B	[110] ±0.5°	4"	380	P/P	ITME	>1	Diced into 18 of 60×4mm rectangles (60mm edge in <001>, 4mm edge in <1,-1,0>), packed adhering to dicing tape afixed to back-up Silicon wafers in Empak cst
H937	25	$38.00	p-type Si:B	[100]	4"	380	P/E	ITME	5-10	SEMI Prime, Individual cst, Diced into 187 rectangles 7mm×5mm, Groups of 8, 8 & 9 wafers
C650	4	$38.00	n-type Si:Sb	[111-4°] ±0.5°	4"	420	P/EOx	SPC	0.008-0.018	Group of 4 wafers diced into 70.11mm Squares
D650	1	$20.00	n-type Si:Sb	[111-4°] ±0.5°	4"	420	P/EOx	SPC	0.008-0.018	Diced into 70.11mm Square, TEST grade (one corner broken), in single wafer cassette

EL-CAT Inc. 80 Railroad Ave., Ridgefield Park, NJ 07660 USA; tel: 201-444-7343; fax: 201-444-7933; e-mail: el-cat@el-cat.com
Web Site Developed By: Mark Zakrzewski mark@el-cat.com