Silicon wafers and III-V substrates

EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other materials for electronics.
EL-CAT Inc. is a manufacturer of specialty Silicon Wafers (as Custom Silicon Wafers).
EL-CAT Inc. is an integrator of services of cooperating manufacturers in creating semiconductor structures that require multiple materials or processing steps (Silicon wafers with Oxide and Nitride coatings, Base or Noble metal layers, Epi structures, etc.).


Current Stock and Prices: Advertised Specials:
Click for details
Specially Priced Ingots & Wafers:
 
Silicon Ingots (monocrystal) 6"Ø Si:As[100](0.0025-0.0055)Ωcm
#CI0a #E207 #F207 #G207 #H207 #M207 #N212
$90.00/Kg
 
Silicon Ingots (monocrystal) 5"Ø Si:As[100](0.0010-0.0058)Ωcm
#2212 #P207 #Q207 #R207 #S207 #T207 #U207 #V207 #W207
$90.00/Kg
#X207 #Y207
 
 
 
P/E 2"Ø×330μm p-type Si:B[111] (5-10)Ωcm
$5.90/wafer
P/E 3"Ø×380μm n-type Si:B[100] (0.001-0.005)Ωcm
$7.90/wafer
P/E 4"Ø×525μm p-type Si:B[111-4.0°] (0.010-0.020)Ωcm
$7.90/wafer
P/E 4"Ø×525μm p-type Si:B[111-3.5°] (0.007-0.009)Ωcm
$7.90/wafer
P/E 4"Ø×525μm n-type Si:Sb[111-3.0°] (0.008-0.020)Ωcm
$7.90/wafer
P/E 4"Ø×525μm n-type Si:As[111-4.0°] (0.001-0.005)Ωcm
$7.90/wafer
P/E 6"Ø×508μm n-type Si:As[111-4.0°] (0.0023-0.0026)Ωcm
$19.90/wafer
 
 
 
P/P 6"Ø×680μm SI InP:Fe[100] Ro>1E7 Ωcm
$390.00/wafer
P/E 48mmØ×280μm n-type GaP:S[100-2°] Nc=(0.48-1.60)E18/cc
$39.00/wafer
 
 
 
On Sapphire P/P 4"Ø×460μm, Intrinsic Silicon[100] 0.60μm thick
$999.00/wafer
On Sapphire P/P 4"Ø×460μm, Intrinsic Silicon[100] 0.35μm thick
$999.00/wafer
On Sapphire P/P 4"Ø×460μm, Intrinsic Silicon[100] 0.22μm thick
$999.00/wafer
 
 
 
6"Ø SOI wafers, Device: Si:B[100](0.05-0.10)Ωcm, 15μm thick
$199.00/wafer
6"Ø SOI wafers, Device: Si:B[100](0.007-0.010)Ωcm, 12μm thick
$199.00/wafer
6"Ø SOI wafers, Device: Si:P[100](14.4-17.6)Ωcm, 50μm thick
$199.00/wafer
6"Ø SOI wafers, Device: Si:P[100](112-138)Ωcm, 175μm thick
$199.00/wafer
2"Ø×430±25μm Sapphire[C] wafers
Front side epi-ready polished, backside fine-ground
Sapphire[0001-0.2°towards[M]]±0.1°
TTV<5μm, Bow<5μm, Warp<8μm
Front Surface Roughness <0.3nm
Back surface roughness (0.8-1.2)μm
Chips<3 @ 0.2mm
$19.20 each, in cassettes of 25 wafers
Numerically Controlled
Laser Cutting, Drilling and Engraving of
Silicon Wafers and Other Materials into
Squares and Arbitrarily Intricate Shapes

Lasers: 20 W IR Laser at 1,060 nm
Lasers: 23 W UV Laser at 355 nm
Work Area: 175 × 350 mm (for IR Laser)
Work Area:  175 × 175 mm (for UV Laser)

Materials Processed:
Silicon, GaAs, InP, SiC, Alumina,
Soda-Lime glass,
Al, Cu, Fe and other metals

Materials NOT Processed:
Quartz, Fused Silica, Sapphire,
Pyrex/Borofloat glass

Laser Engraving Laser Com


Register with EL-CAT Inc. to order / query about special materials, or for special offerings.
EL-CAT Inc. 80 Railroad Ave., Ridgefield Park, NJ 07660 USA;  tel: 201-444-7343;  fax: 201-444-7933;  e-mail: el-cat@el-cat.com
Web Site Developed By: Mark Zakrzewski
mark@el-cat.com